Sinmat offers an unparalleled quality of wafer polishing and reclaim services to its clients. Using its proprietary slurries and CMP processes, the company strives to deliver higher value and lower cost services than its competitors.
- SiC (single- or poly-crystalline)
- Sapphire substrate
- Sapphire PSS
Diamond CMP Polishing
Diamond represents the future material of choice for the semiconductor industry due to its high thermal conductivity. Sinmat polishes diamond substrates (single- or poly-crystalline) with an excellent local and global surface finish.
Sinmat provides wafer reclaim services for various substrate materials (SiC, Sapphire, GaN, etc).
CMP Integration Consulting
Sinmat works with clients to integrate CMP technologies in their facilities and optimize CMP-related operations.
Sinmat has been funded by several SBIR/STTR federal grants to develop innovative polishing techniques for specialized applications such as SiC mirrors, polishing of ultra-hard materials, and development of 450mm wafer planarization technology. Sinmat thanks NSF, DOD, NIST, and DOE for funding some of the company’s technological development.