By: Sinmat  09-12-2011

Sinmat offers an unparalleled quality of wafer polishing and reclaim services to its clients. Using its proprietary slurries and CMP processes, the company strives to deliver higher value and lower cost services than its competitors.

  • SiC (single- or poly-crystalline)
  • GaN
  • Diamond
  • Sapphire substrate
  • Sapphire PSS
  • AlN

Diamond CMP Polishing
Diamond represents the future material of choice for the semiconductor industry due to its high thermal conductivity. Sinmat polishes diamond substrates (single- or poly-crystalline) with an excellent local and global surface finish.

Wafer Reclaim
Sinmat provides wafer reclaim services for various substrate materials (SiC, Sapphire, GaN, etc).

CMP Integration Consulting
Sinmat works with clients to integrate CMP technologies in their facilities and optimize CMP-related operations.

Contract Research
Sinmat has been funded by several SBIR/STTR federal grants to develop innovative polishing techniques for specialized applications such as SiC mirrors, polishing of ultra-hard materials, and development of 450mm wafer planarization technology. Sinmat thanks NSF, DOD, NIST, and DOE for funding some of the company’s technological development.

Other products and services from Sinmat



Custom CMP Slurries Sinmat develops custom-tailored slurries for clients wishing to polish the following materials as per the clients’ specifications. SiC Slurries Sinmat produces CMP slurries for polishing SiC wafers, which are used in high power electronics and LEDs. Different SiC CMP slurries for specific applications.