Photonics’ Light On Board technology
provides optically enabled semiconductor-packaging
solutions for ultra short reach (USR) and short reach
(SR) interconnections to and between integrated circuits
(ICs) on a single printed circuit board (PCB), between
adjacent PCB's and adjacent equipment chassis.
Light On Board is an extreme
high density, high-speed interconnect solution that
offers superior performance without disrupting current
manufacturing methodologies that use standard IC packaging
and standard PCBs, automated equipment and processes.
Light On Board technology continues to respect all aspects
of IC packaging and board assembly such as package size,
footprint, solder-re-flow and chip interconnections
since it is extremely important not to disrupt the processes
developed by IC and PCB manufacturers. All existing
electrical high-speed connections to the ASIC are maintained
in addition to the optical connections added with Light
on Board and all optically enabled chip packages are
connected via industry standard multi-fiber ribbon cables
and patent pending Light on Board mating clips.
Light on Board provides a
platform for optical connectivity by introducing pre-aligned
optical-to-electrical (or electrical-to-optical) channel
connector modules next to IC packages. Integrated within
the channel connector modules are Reflex’s pre-aligned
LightABLE™ Optical Engines: compact,
encapsulated, thin modules that can be pick-and-placed
into the IC package along side the chip. The distance
between the ASIC and the LightABLE Optical
Engine is significantly less than one inch, in order
to immediately convert the ultra-high speed electrical
signals into optical signals.