Wafer Processing

By: Process Photonics  09-12-2011
Keywords: laser, Process Control, Debris Removal

The WP1000 workstation is designed for the bulk removal of protective cover films from semiconductor wafers. The beam from a TEA-CO2 laser (e.g. GSI Lumonics Impact™ series) is converted through the optical beam delivery system to the desired size, shape and energy density for the process requirements. Controlling the rate of movement of the wafer under the beam, and the pulse repetition rate of the laser, defines the total dose of light seen by any particular portion of the wafer. In addition to bulk processing with the whole beam, aperture masks can be used, allowing precision processing of select areas of the wafer.

The team at Process Photonics has a wealth of process and applications knowledge, as well as years of experience in building standard and custom systems. Let them build you a robust, production-ready workstation that is easy to operate and maintain.

System Hardware System Control
· Accepts GSI Lumonics Impact™ 2000 and 3000 series TEA-CO2 lasers, or lasers with similar beam characteristics · Windows XP® based user interface

· User friendly operator screens

· CDRH Class 1 enclosure · Full system diagnostics
· Compatible with class 10,000 clean room environments · Saving of multiple job parameter files
· Vacuum chuck accepts 6"(150mm), 8" (200mm) or 12" (300mm) wafers · Password protection for access to configuration, set-up, and operating screens
· Manual wafer loading · Emergency stop and safety interlock circuits
· Precision ball screw XY stages with high resolution encoder feedback · Optional SECS II/GEM communications interface
· High performance motion and laser controller
· XY stage travel: up to 12"x12" (300 mm x 300 mm) Utilities (workstation only)
· Optical beam delivery configurable for focused spot, line, or mask imaged machining at 9.3 or 10.6µm · Electrical: 120 VAC, single phase, 60Hz, 15 Amps; or220-240 VAC, single phase, 50Hz, 10 Amps
· Large process viewing window · Exhaust: ablation debris removal through 1.5" diameter duct, 100 SCFM typical
· Optional automatic wafer loading/unloading
· Optional integrated power meter for process control · Dimensions (HxWxD): 72"x40"x34" 1817mm x 1010mm x 864mm (excluding laser)
· Optional vision system for precision alignment · Weight: 1050 lbs (475 Kg) (excluding laser)
Process Parameters
· Continuous line and area scanning, or point to point processing
· Programmable laser pulse rate, pulse overlap, and scanning area CE compliant
· Adjustable laser beam shape and energy density * specifications are subject to revision and change

Keywords: Ball Screw, Beam Delivery, Building Standard, Clean Room Environments, Debris Removal, Delivery System, Hardware System, High Resolution Encoder, Integrated Power, laser, Operator Screens, Power Meter, Precision Alignment, Precision Ball, Precision Processing, Process Control, Safety Interlock, System Diagnostics, System Hardware, Wafer Loading,

Contact Process Photonics

Email - none provided

Print this page

Other products and services from Process Photonics


PPI Products

All standard systems, and most custom systems, are designed around a tubular steel weldment for support of the optical beam delivery, motion stages, power distribution, and possibly even the laser depending on the particular system. Optical components are procured from suppliers with a proven track record in quality optics and robust, damage-resistant coatings.



As a result, PPI has the capability to provide detailed support and upgrades for these products, whether related to the beam delivery, software, or process itself. PPI personnel were key to the development of the GSI Lumonics DrillStar® GS-600 and GS-800 products, as well as earlier GS systems. Let us help you maximize machine performance for your particular situation. Process development, consulting and apps lab work.



Each of the four probes as well as the galvanometer-located laser beam have access to the whole 50x50mm field, ensuring that any component location, size, orientation and component density can be accommodated. Circuit designers are no longer limited by the practical size limit on probe card designs; circuits can be as large as the panel itself.



Laser drilling of microvias is now commonplace in the electronics packaging industry, allowing high density circuits to be made for a range of products from cellular phones and other hand-held devices to chip on flex, multi-chip modules, and PCMCIA cards. Process Photonics has developed the rugged ProVia platform, a unique workstation design that has been configured for use with industry-proven CO2 and UV laser sources.


services_DrillStar support

Process Photonics is pleased to offer engineering support for the worldwide installed base of DrillStar â GS600/GS800 laser via drilling machines from GSI Lumonics. Raphaël Ruetsch is a very experienced and highly trained product support specialist, quite knowledgeable on laser drilling systems and related applications.



The current requirements for precision processing of parts for the hard disk drive industry (suspension flex) and the electronics packaging industry are typical of the applications where lasers provide manufacturers with significant advantages. Process Photonics has developed the rugged FP platform, a unique workstation design that has been configured for use with industry-proven CO2 and UV laser sources.



Whether your application involves printed wiring boards, flexible printed circuits, arrays of circuits screen printed on sheets, or any similar application, a ProVision system can be configured to meet your requirements. The ProVision ä inspection stations provide advanced capabilities for inspecting both repetitive or single-piece patterns on flat product stock.