services_DrillStar support

By: Process Photonics  09-12-2011
Keywords: laser, Drilling

Process Photonics is pleased to offer engineering support for the worldwide installed base of DrillStar â GS600/GS800 laser via drilling machines from GSI Lumonics .   Contact Process Photonics by telephone at +1-613-236-8359


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PPI has extended its service and support coverage for European customers.  Raphaël Ruetsch is a very experienced and highly trained product support specialist, quite knowledgeable on laser drilling systems and related applications.  Contact Raphaël for service or technical support on new PPI systems or older GSI Lumonics DrillStar® GS-600 and GS-800 products.

Raphaël Ruetsch  +33 (0) 618 27 11 95

Machine owners can enhance their existing laser drilling capability while protecting their process and equipment investment.   Through its extensive knowledge of laser via drilling and system integration, Process Photonics is able to offer solutions to existing problems and future requirements.

Our capabilities and services include:

  • Software Modifications and Upgrades

Þ     Optimisation and customisation of existing functionality

Þ     New features and options

Þ     Alignment and hole placement

Þ     Vision system capabilities

Þ     File conversion functions

Þ     User interface enhancements

Þ     Customised network interfaces

  • Hardware Modifications and Upgrades

Þ     Beam delivery enhancements

Þ     Laser upgrades and machine conversions

Þ     Throughput and performance enhancements

Þ     Operating cost reduction

Þ     Next generation design rules

Þ     Routing and trenching

Þ     Area skiving

  • Applications Support and Process Development

Þ     Optimisation of machine programming and set-up

Þ     Improved via hole quality

Þ     New materials and constructions

Keywords: Drilling, laser

Contact Process Photonics

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Other products and services from Process Photonics


PPI Products

All standard systems, and most custom systems, are designed around a tubular steel weldment for support of the optical beam delivery, motion stages, power distribution, and possibly even the laser depending on the particular system. Optical components are procured from suppliers with a proven track record in quality optics and robust, damage-resistant coatings.



As a result, PPI has the capability to provide detailed support and upgrades for these products, whether related to the beam delivery, software, or process itself. PPI personnel were key to the development of the GSI Lumonics DrillStar® GS-600 and GS-800 products, as well as earlier GS systems. Let us help you maximize machine performance for your particular situation. Process development, consulting and apps lab work.



Each of the four probes as well as the galvanometer-located laser beam have access to the whole 50x50mm field, ensuring that any component location, size, orientation and component density can be accommodated. Circuit designers are no longer limited by the practical size limit on probe card designs; circuits can be as large as the panel itself.


Wafer Processing

The beam from a TEA-CO2 laser (e.g. GSI Lumonics Impact™ series) is converted through the optical beam delivery system to the desired size, shape and energy density for the process requirements. Controlling the rate of movement of the wafer under the beam, and the pulse repetition rate of the laser, defines the total dose of light seen by any particular portion of the wafer.



Laser drilling of microvias is now commonplace in the electronics packaging industry, allowing high density circuits to be made for a range of products from cellular phones and other hand-held devices to chip on flex, multi-chip modules, and PCMCIA cards. Process Photonics has developed the rugged ProVia platform, a unique workstation design that has been configured for use with industry-proven CO2 and UV laser sources.



The current requirements for precision processing of parts for the hard disk drive industry (suspension flex) and the electronics packaging industry are typical of the applications where lasers provide manufacturers with significant advantages. Process Photonics has developed the rugged FP platform, a unique workstation design that has been configured for use with industry-proven CO2 and UV laser sources.



Whether your application involves printed wiring boards, flexible printed circuits, arrays of circuits screen printed on sheets, or any similar application, a ProVision system can be configured to meet your requirements. The ProVision ä inspection stations provide advanced capabilities for inspecting both repetitive or single-piece patterns on flat product stock.