Process Photonics has developed
the rugged ProVia platform, a unique workstation design that has been
configured for use with industry-proven CO2 and UV laser sources. Three basic
configurations are available:
| || |
machining tool for high volume production |
|Single- and dual-head
for superior process quality |
UV and Hybrid UV+CO2 processing |
semi-vertical load/unload |
|Slip sheet and panel
flipper options |
Laser drilling of microvias is now commonplace in the electronics packaging
industry, allowing high density circuits to be made for a range of
products from cellular phones and other hand-held devices to chip on flex, multi-chip modules,
and PCMCIA cards.
The ProVia drillers
ultimate processing workstations for rigid boards, with high performance galvos
for rapid point-to-point drilling and precise control for fine features.
laser is appropriate for high speed machining (drilling, cutting and
skiving) of dielectrics, while the UV laser is able to machine copper and
provide higher cut quality in many dielectrics. An optional second
galvo head for CO2 -only or UV-only systems can increase
drilling speeds up to 2X over the standard single-head configuration.
Whether your application is with glass- and aramid-reinforced epoxies or
non-reinforced materials (e.g. resin-coated foil), there is a ProVia model
to meet your requirements.