Services :: MuAnalysis

By: Muanalysis  09-12-2011
Keywords: Electronics, Printed Circuit, Integrated Circuits

Expert Analysis. Rigorous quality control.


• electronics • photonics • metals • security • defence • aerospace • automotive • pharmaceuticals • textile • bio-medical •

At MuAnalysis, we offer proven expertise in testing and analysis to customers in a diverse range of industries. We adopted a forensic approach early on, devising new protocols while pioneering solutions to improve the quality of testing. In our sophisticated lab, we test to official standards supported by rigorous quality-control processes.

Testing. Testing.

It's all in the report.

Clients routinely thank us for the completeness and accuracy of our reports. We stick to the facts, and augment the data we record with insightful analysis of what is causing the conditions we observe. Our reports are honest and thorough-so thorough that some companies have been able to revise their designs based on our analysis alone.

At MuAnalysis, we act as your team of forensic scientists. Using rigorous techniques and working with a vast inventory of lab equipment, we quickly verify device parameters, identify fault locations, determine failure modes and isolate the root cause of failures in printed circuit boards, integrated circuits and in discrete components of a wide range of technologies.

MuAnalysis is well known in the analysis field for exceptional skill in the detection of impurities, contaminants, and the identification of material structures. Many of our longstanding clients-other laboratories among them-value the advanced techniques we've developed and the extensive range of equipment we deploy to look deeper than our competitors.

Knowing the life expectancy of devices and systems is key to every manufacturing success. At MuAnalysis, we conduct environmental and electrical stress testing under strictly controlled conditions. Our goal is to activate certain failure mechanisms. This then allows us to identify factors that may influence the reliability and life expectancy of a product.

The Fab Support team at MuAnalysis has extensive experience with Si, SiC, GaAs, GaN and InP processes. Our goal is to ensure that you and your customers maximize profitability by generating optimum yields of highly reliable, high-quality product. Based on our analysis, many of our customers have been able to make critical improvements in design and production with measurable impact on yield rates and profitability.

Teardown analysis comprises a set of techniques for examining devices and materials at the smallest constituent level. The result is a comprehensive report presenting our thorough analysis of the construction and materials of a device as examined from all angles.

Keywords: Electronics, Integrated Circuits, Printed Circuit

Contact Muanalysis

Email - none provided

Print this page

Other products and services from Muanalysis

09-12-2011

Confocal Scanning Acoustic Microscopy (CSAM) :: MuAnalysis

Low frequency transducers, such as 10, 15, 20 and 30 MHz, allow for higher penetration through materials but lower spatial resolution. Scanning Acoustic Microscopy allows the user to examine different interfaces and determine the mechanical integrity of the assembly. Pulses of different frequencies are used to penetrate various materials to examine sample interiors for voids or delamination.


09-12-2011

BGA Layer by Layer Construction Analysis :: MuAnalysis

Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Measurements of critical dimensions on internal layer. Cross-section showing core and blind via. EDX spectrum of intermetallic formation.


09-12-2011

Decapsulation and Repacking of ICs :: MuAnalysis

It protects the fragile semiconductor chip from environmental humidity, chemical contamination, and mechanical stresses. Semiconductor devices are very fragile and must be packaged so they can be mounted on printed circuit boards. Depending on the nature of the device, the package may range from very simple to very complex. In ICs, the epoxy encapsulant must be removed to expose the die for failure analysis.


09-12-2011

Failure Analysis :: MuAnalysis

Our vast inventory of lab equipment and scientific techniques enables us to verify device parameters, identify fault locations, determine failure modes and root-cause of failures in printed circuit boards, discrete components in a wide range of technologies. By classifying Failure Analysis in three broad categories by degree of complexity, this allows us to detect failures as quickly and efficiently as possible.