Failure Analysis :: MuAnalysis

By: Muanalysis  09-12-2011
Keywords: Printed Circuit, Printed Circuit Boards, failure analysis

Our vast inventory of lab equipment and scientific techniques enables us to verify device parameters, identify fault locations, determine failure modes and root-cause of failures in printed circuit boards, discrete components in a wide range of technologies.

By classifying Failure Analysis in three broad categories by degree of complexity, this allows us to detect failures as quickly and efficiently as possible. The results of each level of analysis are recorded in an appropriate report.

Level 1: We quickly pinpoint the defect using non-invasive microscopy techniques.

Level 2: When the defect is hidden, we localize it by using more advanced techniques to actually reproduce the failure in the lab.

Level 3: We determine root-cause by open-ended analysis, to gain understanding of the nature of the failure and its relationship to observed faults or defects. MuAnalysis undertakes each step in this Level 3 analysis only with approval of our customer.

Keywords: failure analysis, Printed Circuit, Printed Circuit Boards

Contact Muanalysis

Email - none provided

Print this page

Other products and services from Muanalysis


Confocal Scanning Acoustic Microscopy (CSAM) :: MuAnalysis

Low frequency transducers, such as 10, 15, 20 and 30 MHz, allow for higher penetration through materials but lower spatial resolution. Scanning Acoustic Microscopy allows the user to examine different interfaces and determine the mechanical integrity of the assembly. Pulses of different frequencies are used to penetrate various materials to examine sample interiors for voids or delamination.


BGA Layer by Layer Construction Analysis :: MuAnalysis

Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Measurements of critical dimensions on internal layer. Cross-section showing core and blind via. EDX spectrum of intermetallic formation.


Decapsulation and Repacking of ICs :: MuAnalysis

It protects the fragile semiconductor chip from environmental humidity, chemical contamination, and mechanical stresses. Semiconductor devices are very fragile and must be packaged so they can be mounted on printed circuit boards. Depending on the nature of the device, the package may range from very simple to very complex. In ICs, the epoxy encapsulant must be removed to expose the die for failure analysis.


Services :: MuAnalysis

Using rigorous techniques and working with a vast inventory of lab equipment, we quickly verify device parameters, identify fault locations, determine failure modes and isolate the root cause of failures in printed circuit boards, integrated circuits and in discrete components of a wide range of technologies.