BGA Layer by Layer Construction Analysis :: MuAnalysis

By: Muanalysis  09-12-2011

Cross-section showing core and blind via

Internal layer of BGA package

EDX spectrum of intermetallic formation

Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.

Typical Applications


Measurements of critical dimensions on internal layer

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