Tracan: MEN Micro, Inc. - XM1L

By: Tracan  09-12-2011

Highlights

  • RSE, Rugged System-On-Module Express (ANSI-VITA 59 in process)
  • Intel® Atom™ Z510P, Z530P, Z510PT, Z520PT
  • Up to 2 GB DDR2 SDRAM
  • Up to 2 PCI Express®
  • Up to 1 Gb Ethernet
  • 1 SATA port
  • 8 USB 2.0
  • SDVO, LVDS
  • Intel® HD Audio
  • -40°C to +85°C screened or qualified
  • Conduction cooling

Details

The XM1L is a Computer-On-Module of the ESMexpress® family in accordance with a proposed ANSI standard currently under development (ANSI-VITA 59, RSE Rugged System-On-Module Express). Together with an application-specific carrier board it forms a semicustom solution for industrial, harsh, mobile and mission-critical environments.

The XM1L is controlled by the Intel® Atom™ XL processor, an IA-32 core based on 45nm process technology which is qualified for the industrial temperature range. Due to the power architecture of the Intel® Atom™ CPU, the XM1L has a total power consumption of max. 5 to 7 Watts, while having a clock frequency of up to 1.6 GHz. The XM1L accommodates up to 2 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board.

Interfaces from the Intel® System Controller Hub US15WP are optimized using exclusively modern serial standards and are all routed from the XM1L for availability on any ESMexpress® carrier board. Depending on the version of XM1L, those interfaces include a combination of PCI Express® links, LVDS, SDVO, high-definition audio, SATA, Ethernet with wakeon- LAN functionality, and USB. Additional COM interfaces can be made available on the carrier board via USB to COM conversion.

The XM1L is completed by a board management controller for temperature and power supervision. It comes with a Phoenix® Award BIOS configurable for the final application.

The XM1L is screened or qualified for operation in a -40°C to +85°C conduction or convection cooled environment. As all ESMexpress® modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling.

Air cooling is also possible by applying a heat sink on top of the cover. Where operation temperatures are moderate, the module may even do without the frame and cover, with a suitable low-power processor and airflow. ESMexpress® modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating. All ESMexpress® modules support a single 95x125mm form factor.

For evaluation and development purposes an ATX carrier board is available. The ESMexpress® module can be evaluated on a COM Express™ carrier board via an adapter from ESMexpress® to COM Express™.


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09-12-2011

Tracan Electronics Corporation

We don't just stop at COTS level integration, but can deliver custom electronic designs, base boards for system on modules and system on chips, enclosures for commercial or rugged environments as well as a full array of software support. We understand the complexities of today's design, be it thermal & power management, component life cycle management, packaging technologies such as die cast or injection molding, real-time operating systems.