Welcome to Radian Heatsinks

By: Radian Heatsinks  09-12-2011
Keywords: Extruded Aluminum

The INL Series of aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.

Features:

  • Low Profile high density heatsink
  • High efficiency aluminum plate fin design provides low pressure-drop characteristics
  • Constructed of extruded aluminum AL6063 for optimum heat transfer
  • Ideal for linear air flow environments
  • Designed specifically for BGAs and other surface mount packages
  • Optional EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon
  • Use Clip Tool HS8063 to attach or remove heatsink assembly directly to BGA Chip
  • Finished with black anodize plating
  • Selected clip & thermal pad options are preassembled at the factory

Keywords: Extruded Aluminum