LD Micro Precision - products
Tungsten Carbide, BERYLLIUM COPPER
- Wire Bonding Tools
- Applying proprietary Solution Materials, we design and produce Wire Bonding EFO (electrode) that generates excellent and consistent air balls. We have wide range of EFO for most Wire Bonders.
- QA Bond Test Tools
- High performance with excellent quality finishing developed with LD's own technology. Our QA Bondtest tools with good finishing will ensure high durability and extended lifespan.
- Wafer Sorting
- Our test probes (both cantilever and vertical type) are machined from tungsten, tungsten-rhenium, beryllium copper or tungsten carbide with high polish finishing for excellent performance.
- Our developed proprietary processes is able to refurbish or recondition the capillary/wedges tip and ensure prolong bonding quality.
, Tungsten Carbide