A wide selection of tools consisting of support of more than 40 package families or an intelligent wizard that assists in selecting the appropriate package family allow the user to quickly and easily create the design of interest.
Automated Generation of JEDEC Thermal Metrics
Take advantage of wizard-driven software to automatically generate a complete set of JEDEC thermal data metrics for a single package or multiple packages in batch or standard and user-defined test PCBs.
Automated Compact Thermal Model Creation
Support of two-resistor (2-R) and DELPHI compact thermal models for single or multiple packages is included in FloTHERM IC.
Searchable Database and Libraries
Use the comprehensive results database to select the optimal starting point for a new package design from your previous solutions.
Package constituents such as die, die attach, die attach pad, substrate, leadframe, lid, etc, can be stored as separate library items, thus greatly speeding new package creation.
The range of supported packages is continuously updated to capture rapid advances in packaging technology, (e.g. System-in-Package (SiP) and stacked die).
Sensitivity Analysis Capability