Creative Electron’s patented transient liquid phase sintering (TLPS) adhesives are innovative die-attach materials for electronics packaging. Our TLPS technology is ideally suited for device level thermal management of wide bandgap semiconductors, high brightness light emitting diodes (HB-LEDs), concentrator photovoltaics (CPV), hybrid electric vehicles (HEV), and RF power amplifiers. TLPS materials are an alternative to solder pre-forms and solder pastes, with the added advantages of being solvent-free, flux (residue)-free, dispensable with existing manufacturing equipment, and thermally reworkable. TLPS materials are also an alternative to conductive adhesives, with the added advantages of long-term contact stability and greatly enhanced thermal conductivity over a bondline, often by an order of magnitude or better. Although TLPS materials are processed like adhesives, formation of metallurgical interfaces result in enhanced thermal and electrical properties.
TLPS adhesives form metallurgical bonds during the cure process that provide very high “ effective thermal conductivity ” in the bondline, much closer to solder materials than silver-filled epoxies. Adhesion retention remains stable after high temperature and high humidity storage, as well as after thermal cycling. The polymer matrix acts as both an adhesive binder for the filler particles and as a flux to remove oxides from the surfaces of the metal powders, allowing the powders to liquid-phase sinter during cure. The new die-attach materials are fully compatible with conventional dispensing equipment as well as with screen printing. For more information, follow the links below to download technical data-sheets and MSDS.
Lead-Free TLPS Formulation CELF108: /
Lead-Free TLPS Formulation ATLF61: /
SnPb TLPS Formulation CELV310: /