CORWIL | Services

By: Corwil  09-12-2011
Keywords: package design, Card Design, package

CORWIL Technology Corporation is the premier, US based, IC assembly and test services subcontractor. We offer full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, wirebond, package sealing and final test. CORWIL has the experience to meet your most demanding challenges in Flip Chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe, and wafer thinning, polishing and dicing.

CORWIL is dedicated to meeting customer expectations, producing excellent quality products, and providing superior service to its growing base of more than 1000 customers.

CORWIL has established itself as the leading IC assembly subcontractor in the U.S. for quick-turn prototypes, small and medium size production lots, as well as full production volumes for high-reliability and mil-spec devices. From wafer to finished product, CORWIL can deliver all types of packages in as quickly as 4 hours, or can schedule production deliveries on a weekly basis to meet your needs.

CORWIL can guide you through the process from design to assembly of SIP, MCM, and RF modules as well as Stacked Die Assemblies.

With DSCC certifications & ITAR registration, CORWIL is qualified to be the total value solution for all your Military and Aerospace IC assembly and test needs.

CORWIL's world-class wafer processing facility thins and dices Silicon, GaAs, Sapphire, Quartz, Laminates, Indium Phosphate, Glass and other materials in low & high volume quantities.

CORWIL's test services include environmental test, software development, probe card and interface card design and fabrication, wafer electrical probe, and final test.

CORWIL's engineering team stays at the forefront of semiconductor package design and process technology. CORWIL's engineering expertise has resulted in several proprietary manufacturing and packaging innovations which have solved customer product configuration and manufacturing problems.

Keywords: Card Design, Interface Card, package, package design, Wafer

Other products and services from Corwil


CORWIL | Engineering

For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam or a Re-Distribution Layer of metal, customers trust CORWIL. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors.


CORWIL | Environmental & Electrical Test

CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes. CORWIL can design and procure custom probe cards for wafer probing your IC wafers. Custom test software development is available for CORWIL's digital test systems. Probecard & Interface Card Design & Fabrication.


CORWIL | MIL / Aerospace

Whether you need to place commercial die in a hermetic package or perform additional screening to an existing plastic, we can help you meet your requirements. CORWIL offers a host of solutions to fill the need for cutting edge technology in hermetic packages. CORWIL provides a wide range of ceramic packages that are suitable for Military and Aerospace use. CORWIL's management has over 100 years of service in the Military/Aerospace industry.


CORWIL | Wafer Thinning & Dicing

CORWIL processes tens of millions of dice per month and is the leading provider of wafer sawing and die visual inspection services for the leading heart pacemaker, RFID, hearing aid and defibrillator manufacturers. CORWIL routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.


CORWIL | SIP & MCM Modules

SIPs (System in Package) and MCMs are substrates containing multiple interconnected components (SMT components, Flip Chips, WLCSP, and/or wirebonded ICs) whose body outline and leads or ball array conform to conventional IC package, such as a JEDEC registered BGA. RF Modules are SIPs or MCMs that require special substrate design, materials, and soldering in order to achieve the high frequency and performance desired.


CORWIL | IC Assembly

Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide. CORWIL can assemble devices into Open Cavity plastic packages in prototype quantities in as quickly as 8 hours from receipt of the packages. CORWIL assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.