CORWIL Technology Corporation is the premier, US based, IC assembly and test services subcontractor. We offer full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, wirebond, package sealing and final test. CORWIL has the experience to meet your most demanding challenges in Flip Chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe, and wafer thinning, polishing and dicing.
CORWIL is dedicated to meeting customer expectations, producing excellent quality products, and providing superior service to its growing base of more than 1000 customers.
CORWIL has established itself as the leading IC assembly subcontractor in the U.S. for quick-turn prototypes, small and medium size production lots, as well as full production volumes for high-reliability and mil-spec devices. From wafer to finished product, CORWIL can deliver all types of packages in as quickly as 4 hours, or can schedule production deliveries on a weekly basis to meet your needs.
CORWIL can guide you through the process from design to assembly of SIP, MCM, and RF modules as well as Stacked Die Assemblies.
With DSCC certifications & ITAR registration, CORWIL is qualified to be the total value solution for all your Military and Aerospace IC assembly and test needs.
CORWIL's world-class wafer processing facility thins and dices Silicon, GaAs, Sapphire, Quartz, Laminates, Indium Phosphate, Glass and other materials in low & high volume quantities.
CORWIL's test services include environmental test, software development, probe card and interface card design and fabrication, wafer electrical probe, and final test.
CORWIL's engineering team stays at the forefront of semiconductor package design and process technology. CORWIL's engineering expertise has resulted in several proprietary manufacturing and packaging innovations which have solved customer product configuration and manufacturing problems.