CORWIL | MIL / Aerospace

By: Corwil  09-12-2011
Keywords: Prototype Assembly, Ceramic Packages

Our Processes include:

  • MIL-PRF-38535 QML'Q' ( Class B ) Certified
  • MIL-PRF-38535 QML'V' ( Class S ) Certification in process
  • MIL-PRF-19500
  • Custom Flows ( Q+ or V- )
  • Source Control Drawings

MIL/Aerospace Packages

CORWIL provides a wide range of ceramic packages that are suitable for Military and Aerospace use.

Our Packages include:

  • Cerdip and Sidebrazed
  • Flatpacks and Cerpacks
  • SOIC
  • LCC and JLCC
  • PGA
  • TO Cans / Headers
  • Custom Packages

MIL/Aerospace Products

CORWIL has the capabilities to assemble and manage a wide range of products for Military and Aerospace applications, including:

  • Discrete ICs: Diodes and Transistors
  • Analog and Mixed Signal ICs:
  • Op Amps
  • Comparators
  • Voltage References / Voltage Regulators
  • AD / DA Converters

Enhanced COTS (Commercial Off The Shelf)

CORWIL offers a host of solutions to fill the need for cutting edge technology in hermetic packages. As many semiconductor manufacturers have moved to extended-temperature plastic processes (-40 to +85°C) there is a significant gap for some Military and Aerospace programs.

CORWIL can provide the service for these missing gaps.

Whether you need to place commercial die in a hermetic package or perform additional screening to an existing plastic, we can help you meet your requirements.

Options include:

  • Assemble Commercial Die in Hermetic Packages
  • Extend Electrical Test to cover Mil-Temp Range (-55 to +125°C)
  • Custom Options

Program Management

CORWIL's management has over 100 years of service in the Military/Aerospace industry. We believe that understanding the customer's needs is paramount to providing excellent service. We offer a selection of unique services that are available as part of a manufacturing order or as stand-alone items.

  • Radiation Management for high and low-dose rate (ELDR) testing
  • Discontinued Product Management
  • Engineering Services
  • Quick-turn Prototype Assembly

Keywords: Ceramic Packages, Prototype Assembly,

Other products and services from Corwil


CORWIL | Engineering

For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam or a Re-Distribution Layer of metal, customers trust CORWIL. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors.


CORWIL | Environmental & Electrical Test

CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes. CORWIL can design and procure custom probe cards for wafer probing your IC wafers. Custom test software development is available for CORWIL's digital test systems. Probecard & Interface Card Design & Fabrication.


CORWIL | Wafer Thinning & Dicing

CORWIL processes tens of millions of dice per month and is the leading provider of wafer sawing and die visual inspection services for the leading heart pacemaker, RFID, hearing aid and defibrillator manufacturers. CORWIL routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.


CORWIL | SIP & MCM Modules

SIPs (System in Package) and MCMs are substrates containing multiple interconnected components (SMT components, Flip Chips, WLCSP, and/or wirebonded ICs) whose body outline and leads or ball array conform to conventional IC package, such as a JEDEC registered BGA. RF Modules are SIPs or MCMs that require special substrate design, materials, and soldering in order to achieve the high frequency and performance desired.


CORWIL | Services

CORWIL has established itself as the leading IC assembly subcontractor in the U.S. for quick-turn prototypes, small and medium size production lots, as well as full production volumes for high-reliability and mil-spec devices. CORWIL has the experience to meet your most demanding challenges in Flip Chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe, and wafer thinning, polishing and dicing.


CORWIL | IC Assembly

Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide. CORWIL can assemble devices into Open Cavity plastic packages in prototype quantities in as quickly as 8 hours from receipt of the packages. CORWIL assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.