CORWIL | IC Assembly

By: Corwil  09-12-2011
Keywords: Wafer, Plastic Packages, Ceramic Packages,

CORWIL partners with customers to provide them with the highest-quality IC assembly services to achieve their goals. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly. CORWIL assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.

CORWIL understands that time is of the essence in this fast-paced technology. We use state-of-the-art machines in our facility to support and turn many different types of IC assemblies in as quickly as 4 hours. Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide!

  • Ultra-fine pitch bonding
  • A wide variety of QFN packages
  • For BGAs - all Ball Configurations, Wire Counts, and Body Sizes
  • For Custom and Module assemblies - Customer or CORWIL supplied substrates
  • Sealing Method: dam and fill, transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die
  • Standard cycle time: 5 working days; Quick-turns as fast as 4 hours

CORWIL is always looking to the future and investing in new equipment to match our customers' needs, help them stay ahead of product life cycles, and keep them on the forefront of emerging markets and technologies.

  • Full wafer preparation:

    • Wafer grinding, thinning and polishing (75mm to 300mm wafer diameters)
    • Wafer sawing and dicing (the first U.S. supplier to offer 300mm dicing and DBG - dice before grind)
    • Die plating and pick and place
    • Die inspection - manual and automated
  • IC package engineering & assembly:

    • Die attach
    • Wire bond (Aluminum and Gold)
    • Flip Chip
    • Encapsulation and transfer mold
    • Substrate solder ball attach
    • Device Singulation

  • Hermetic & Ceramic

    From wafer to finished product, CORWIL can deliver in as quickly as 4 hours! CORWIL assembles all types of hermetic and ceramic packages including:

    • PGAs (pin-up or pin-down configurations-with and without heat sinks)
    • Sidebraze
    • Cerquad
    • Quad Flat-Pack
    • Cerdip, Cerpak
    • Flat-Pack
    • Ceramic SOIC
    • LLC
    • JLCC (PLCC equivalent)
    • Metal Cans
    • Headers

  • Plastic

    CORWIL can assemble devices into Open Cavity plastic packages in prototype quantities in as quickly as 8 hours from receipt of the packages! Plastic Open Cavity package equivalents are available for:

    • TSSOP
    • MSOP
    • SOIC
    • PQFP
    • And other package configurations

  • BGA

    CORWIL's Ball Grid Array assembly capabilities include:

    • Ultra-fine pitch bonding
    • All Ball Configurations, Wire Counts, and Body Sizes
    • Customer or CORWIL-supplied substrates
    • Sealing Method: dam and fill, transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die
    • Substrate design and fabrication

  • Flip Chip

    CORWIL's Flip Chip product capabilities include:

    • Flip Chip in package (FCIP) such as FCBGA and Flip Chip on board (FCOB)
    • Organic laminates or ceramic substrates
    • Single or multiple Flip Chip and wire-bonded IC's in hybrids or multi-chip modules
    • Bonding of solder bumped dice to substrates with an accuracy as tight as 5 microns
    • Solder joints are reflowed in nitrogen under tight temperature control and reflow profiles are available for eutectic and also for lead-free solder
    • Gold stud bumping
    • Studded die can be thermosonically joined to customer substrates, or soldered using a gold tolerant solder

  • QFN & DFN

    CORWIL can assemble your IC die into a wide range of QFN and DFN options:

    • Leadframes ranging from 3x3mm to 12x12mm body sizes
    • Pin counts from 8 to 88 leads
    • Custom leadframe design and fabrication in as little as 3 weeks

  • SIP/MCM Modules

    CORWIL can design your custom module. Our multi-component assembly options include:

    • Stacked die
    • SMT components
    • Package-on-package
    • Combined Flip Chip
    • Wirebond structures

Let CORWIL show you how we can meet ALL your IC assembly requirements!

Keywords: Ceramic Packages, Open Cavity Plastic, Plastic Packages, Wafer, Wafer Sawing,

Other products and services from Corwil


CORWIL | Engineering

For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam or a Re-Distribution Layer of metal, customers trust CORWIL. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors.


CORWIL | Environmental & Electrical Test

CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes. CORWIL can design and procure custom probe cards for wafer probing your IC wafers. Custom test software development is available for CORWIL's digital test systems. Probecard & Interface Card Design & Fabrication.


CORWIL | MIL / Aerospace

Whether you need to place commercial die in a hermetic package or perform additional screening to an existing plastic, we can help you meet your requirements. CORWIL offers a host of solutions to fill the need for cutting edge technology in hermetic packages. CORWIL provides a wide range of ceramic packages that are suitable for Military and Aerospace use. CORWIL's management has over 100 years of service in the Military/Aerospace industry.


CORWIL | Wafer Thinning & Dicing

CORWIL processes tens of millions of dice per month and is the leading provider of wafer sawing and die visual inspection services for the leading heart pacemaker, RFID, hearing aid and defibrillator manufacturers. CORWIL routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.


CORWIL | SIP & MCM Modules

SIPs (System in Package) and MCMs are substrates containing multiple interconnected components (SMT components, Flip Chips, WLCSP, and/or wirebonded ICs) whose body outline and leads or ball array conform to conventional IC package, such as a JEDEC registered BGA. RF Modules are SIPs or MCMs that require special substrate design, materials, and soldering in order to achieve the high frequency and performance desired.


CORWIL | Services

CORWIL has established itself as the leading IC assembly subcontractor in the U.S. for quick-turn prototypes, small and medium size production lots, as well as full production volumes for high-reliability and mil-spec devices. CORWIL has the experience to meet your most demanding challenges in Flip Chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe, and wafer thinning, polishing and dicing.