CORWIL | Engineering

By: Corwil  09-12-2011
Keywords: Engineering, package design, package

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CORWIL is recognized by the industry as a technology leader and is staffed by skilled engineers with many years of hands-on experience. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors. CORWIL's engineers have published and presented papers and tutorials at various technical conferences worldwide.

CORWIL engineers are experts in package design, materials selection, assembly process compatibility, high yield manufacturing, and issues affecting package integrity. Our engineering team is organized by process areas, such as wafer thinning and dicing, Flip Chip, wire-bond, die picking and inspection, QFN and other plastic package assembly, and electrical test. In all these areas, the engineering team is working on the latest technologies.

In the area of dicing, CORWIL can produce ultra-thin .001" thick dice using the dice before grind (DBG) method. This is much thinner than the thickness of paper. In addition, CORWIL was one of the first companies to use Die Attach Film (DAF) which is critical for stacked die assemblies, and CORWIL now produces many millions of DAF die per month. In the area of Flip Chip, CORWIL has packaged many exotic Flip Chip designs, including ultra high bump count dice in excess of 3000 bumps. And, CORWIL has the ability to wirebond complicated ultra-fine-pitched BGA dies with multiple tiers. For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam (FIB) or a Re-Distribution Layer of metal (RDL), customers trust CORWIL.

CORWIL's engineering resources work with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and failure analysis, and to develop manufacturable package solutions for high volume production. We understand that effective communication with our customers is what ensures the success of our customers' designs, proof of concepts, and final products.

CORWIL's engineering team can be your IC package design and development partner.

Keywords: Dice, Engineering, package, package design

Other products and services from Corwil


CORWIL | Environmental & Electrical Test

CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes. CORWIL can design and procure custom probe cards for wafer probing your IC wafers. Custom test software development is available for CORWIL's digital test systems. Probecard & Interface Card Design & Fabrication.


CORWIL | MIL / Aerospace

Whether you need to place commercial die in a hermetic package or perform additional screening to an existing plastic, we can help you meet your requirements. CORWIL offers a host of solutions to fill the need for cutting edge technology in hermetic packages. CORWIL provides a wide range of ceramic packages that are suitable for Military and Aerospace use. CORWIL's management has over 100 years of service in the Military/Aerospace industry.


CORWIL | Wafer Thinning & Dicing

CORWIL processes tens of millions of dice per month and is the leading provider of wafer sawing and die visual inspection services for the leading heart pacemaker, RFID, hearing aid and defibrillator manufacturers. CORWIL routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.


CORWIL | SIP & MCM Modules

SIPs (System in Package) and MCMs are substrates containing multiple interconnected components (SMT components, Flip Chips, WLCSP, and/or wirebonded ICs) whose body outline and leads or ball array conform to conventional IC package, such as a JEDEC registered BGA. RF Modules are SIPs or MCMs that require special substrate design, materials, and soldering in order to achieve the high frequency and performance desired.


CORWIL | Services

CORWIL has established itself as the leading IC assembly subcontractor in the U.S. for quick-turn prototypes, small and medium size production lots, as well as full production volumes for high-reliability and mil-spec devices. CORWIL has the experience to meet your most demanding challenges in Flip Chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe, and wafer thinning, polishing and dicing.


CORWIL | IC Assembly

Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide. CORWIL can assemble devices into Open Cavity plastic packages in prototype quantities in as quickly as 8 hours from receipt of the packages. CORWIL assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.