HiComm - Products

By: Hicomm  09-12-2011
Keywords: Laser Drilling

  • Layers: up to 24 layers

  • Base material: FR1, FR2, CEM1, CEM3, FR4, Rogers, Polyamide

  • Base thickness: 8 to 236 mils

  • Copper thickness: inner layers 0.5 to 6 oz; outer layers 1 to 6.5 oz

  • Max size: 23” x 43”

  • Min track width/space: 4/5 mils on 0.5 oz; 5/5 mils on 1 oz

  • Min annular ring:

    • 5 mils on mechanical drilling, 

    • 3 mils on laser drilling

  • Min drill diameter:

    • 8 mils for mechanical drilling

    • 4 mils for laser drilling, no more than 6 mil thickness

    • Max aspect ratio: 12 : 1

  • Distance between line and board edge:

    • Outline: 8 mils, V-CUT: 16 mils

  • Surface finishing: Conductive polymer, HASL, Lead free HASL, Ni/Au, Ag, and Sn

  • Solder mask: 4 mil window and 6 mil bridge; green, blue, black, red

  • Legend: min line width 5 mil; white, black, yellow

  • Testing: Speedy Flying Probes, JIG

  • Keywords: Laser Drilling